The global automotive industry experienced a 47% decline in the number of cloud-related patent applications in Q2 2023 compared with the previous quarter. The total number of cloud-related grants dropped by 25% in Q2 2023, according to GlobalData’s Patent Analytics. GlobalData’s Cloud Computing in Automotive – Thematic Intelligence market report provides a detailed understanding on how Cloud impacts the value chain in the Automotive sector, and the leading Cloud adopters and vendors in the market. Buy the report here.

Notably, the number of cloud-related patent applications in the automotive industry was 157 in Q2 2023, versus 297 in the prior quarter.

The top five companies accounted for 24% of patenting activity

Analysis of patenting activity by companies shows that International Business Machines filed the most cloud patents within the automotive industry in Q2 2023. The company filed 13 cloud-related patents in the quarter, compared with 18 in the previous quarter. It was followed by Strong Force Iot Portfolio 2016 with 8 cloud patent filings, AT&T (6 filings), and Dell Technologies (5 filings) in Q2 2023.

Patenting activity was driven by the US with a 90% share of total patent filings

The largest share of cloud related patent filings in the automotive industry in Q2 2023 was in the US with 90%, followed by China (4%) and the UK (1%). The share represented by the US was 14% higher than the 76% share it accounted for in Q1 2023.

To further understand GlobalData's analysis on Cloud Computing in Automotive – Thematic Intelligence buy the report here.

This content was updated on 2 August 2023


GlobalData, the leading provider of industry intelligence, provided the underlying data, research, and analysis used to produce this article.

GlobalData’s Patent Analytics tracks patent filings and grants from official offices around the world. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.